Effect of Ti Element Addition on the Microstructure and Microhardness of Lead-free Sn3.5Ag0.5Cu Alloy
Effect of Ti Element Addition on the Microstructure and Microhardness of Lead-free Sn3.5Ag0.5Cu Alloy
| Year | 2011 |
| Author | 朱中平, 曹龍泉* |
| Author count | 2 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 6 |
| Journal name | 鑄造工程學刊 |
| Journal sponsor | 台灣鑄造學會 |
| Publication area | 中華民國 |
| Start page | 29 |
| End page | 34 |
| Publication type | |
| Review system | 否 |
| Language | Traditional Chinese |
| Attached project | 無 |