Effect of In Addition on Sn-Ag-Sb Lead-Free Solder System
| Year | 2008 |
| Author | H.T. Lee*, Y.F. Chen, 洪廷甫, H.W. Huang |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 3 |
| Corresponding author | false |
| Publication year | 2008 |
| Symposium name | 10th International Conference on Electronics Materials and Packaging |
| Publication city | 台北 |
| Publication country | 中華民國 |
| Start date | 2008-12-09 |
| End date | 2008-12-09 |
| Review system | 否 |
| Language | Foreign Language |