Effect of Cooling Rate on Ag3Sn Formation in Sn-Ag Based Lead-free Solder
| Year | 2009 |
| Author | H.T. Lee, Y.F. Chen, 洪廷甫*, K.T. Shih |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第三作者 |
| Corresponding author | 是 |
| Publication year | 2009 |
| Publication month | 12 |
| Journal name | IEEE Xplore |
| Publication area | 中華民國 |
| Start page | 875 |
| End page | 878 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |