Effect of Al203 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish
| Year | 2011 |
| Author | T. H. Cheng, 曹龍泉*, F. S. Wang, W. Y. Kuo |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 8 |
| Journal name | 2011 International Conference on Electronic Packaging Technology & High Density Packaging |
| Publication area | 中華民國 |
| Start page | 374 |
| End page | 378 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |