Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE)filler
| Year | 2013 |
| Author | 曹龍泉* |
| Author count | 1 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2013 |
| Publication month | 3 |
| Journal name | Materials Science & Engineering A |
| Journal sponsor | Elsevier |
| Publication area | 中華民國 |
| Issue | 565 |
| Start page | 63 |
| End page | 71 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |