Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn−Ag−Ti active solder
| Year | 2018 |
| Author | 曹龍泉*, S. Y. CHANG, Y. C. YU |
| Author count | 3 |
| Created date | 2019-03-18 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2018 |
| Publication month | 4 |
| Journal name | Trans. Nonferrous Met. Soc. China |
| Journal sponsor | Elsevier |
| Publication area | 荷蘭王國 |
| Issue | 28 |
| Start page | 748 |
| End page | 756 |
| Publication type | |
| Review system | 是 |
| Language | Bilingual |
| Attached project | 科技部MOST 105-ET-E-020- 002-ET, 105-2622-E-020-003-CC3. |