Chip-scale package構裝模組在溫度循環試驗下的結構應力模擬

Chip-scale package構裝模組在溫度循環試驗下的結構應力模擬

吳德和

College of Engineering Department of Mechanical Engineering

Professor derhowu@mail.npust.edu.tw

Year	2011
Author	吳德和, 盧威華*
Author count	2
Created date	2019-02-19
Author order	1
Corresponding author	false
Publication year	2011
Symposium name	兩岸綠色暨防災科技學術研討會
Publication city	Pingtung
Publication country	中華民國
Start date	2011-10-12
End date	2011-10-12
Review system	否
Language	Traditional Chinese