An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate
| Year | 2011 |
| Author | 曹龍泉* |
| Author count | 1 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 11 |
| Journal name | Materials Science and Engineering A |
| Publication area | 中華民國 |
| Issue | 529 |
| Start page | 41 |
| End page | 48 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |