Adsorption equilibrium of polyethylene glycol in the copper electroplating solution on activated carbon

Adsorption equilibrium of polyethylene glycol in the copper electroplating solution on activated carbon

Professor    (08)770-3202#7399 (08)770-3202#5220    wttsai@mail.npust.edu.tw
Year2000
Author蔡文田*
Author count1
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2000
Publication month10
Journal nameJOURNAL OF COLLOID AND INTERFACE SCIENCE
Publication area中華民國
Volume232
Issue1
Start page207
End page209
Publication type
Review system
LanguageForeign Language
Attached project