Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
| Year | 2008 |
| Author | S.Y.Chang*, T.H.Chuang, 曹龍泉, C.L.Yang, Z.S.Yang |
| Author count | 5 |
| Created date | 2019-02-19 |
| Author order | 第三作者 |
| Corresponding author | 否 |
| Publication year | 2008 |
| Publication month | 3 |
| Journal name | J Mater. Process Technol., |
| Publication area | 中華民國 |
| Volume | 202 |
| Issue | 1-3 |
| Start page | 22 |
| End page | 26 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |