A Refined Finite Element Model Verification for IC Packaged PCB with Thermal Effects
| Year | 2010 |
| Author | 王栢村*, Xiu-Wei Liang, |
| Author count | 3 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2010 |
| Symposium name | The 5th International Microsystems,Packaging,Assembly and Circuits Technology Conference(IMPACT 2010) |
| Publication city | 台北 |
| Publication country | 中華民國 |
| Start date | 2010-10-20 |
| End date | 2010-10-20 |
| Review system | 否 |
| Language | Foreign Language |