A Refined Finite Element Model Verification for IC Packaged PCB with Thermal Effects
| Year | 2010 |
| Author | 王栢村*, Xiu-Wei Liang, Fu-Xiang Hsu, Yi-Shao Lai, Chang-Lin Yeh, Ying-Chih Lee |
| Author count | 6 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2010 |
| Publication month | 1 |
| Journal name | ASE Technology Journal |
| Publication area | 中華民國 |
| Volume | 3 |
| Issue | 2 |
| Start page | 146 |
| End page | 153 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |