隨機振動與熱效應複合負載之印刷電路板響應預測分析
| Year | 2010 |
| Author | 王栢村*, , , , , |
| Author count | 6 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2010 |
| Symposium name | 2010 ANSYS Conference |
| Publication city | 台北 |
| Publication country | 中華民國 |
| Start date | 2010-10-14 |
| End date | 2010-10-14 |
| Review system | 否 |
| Language | Traditional Chinese |