晶片厚度及銅凸塊位置在熱壓接合製程下對構裝結構應力效應
| Year | 2016 |
| Author | |
| Created date | 2019-01-16 |
| Author order | 1 |
| Corresponding author | true |
| Publication year | 2016 |
| Symposium name | 2016光電與通訊工程應用研討會 |
| Publication city | 高雄 |
| Publication country | 中華民國 |
| Start date | 2016-11-25 |
| End date | 2016-11-25 |
| Review system | 是 |
| Language | Traditional Chinese |