改變晶片厚度對圓柱形錫球晶片尺寸構裝模組在迴焊及膠材硬化製程條件下之塑性應變能密度效應
| Year | 2017 |
| Author | |
| Created date | 2019-01-16 |
| Author order | 1 |
| Corresponding author | true |
| Publication year | 2017 |
| Symposium name | 2017光電與通訊工程應用研討會 |
| Publication city | 高雄 |
| Publication country | 中華民國 |
| Start date | 2017-12-01 |
| End date | 2017-12-01 |
| Review system | 是 |
| Language | Traditional Chinese |