四晶片系統封裝之疊合晶片偏移距離在膠材硬化製程條件下對結構應力之影響
| Year | 2015 |
| Author | |
| Created date | 2019-01-16 |
| Author order | 1 |
| Corresponding author | true |
| Publication year | 2015 |
| Symposium name | 2015光電與通訊工程應用研討會 |
| Publication city | 高雄 |
| Publication country | 中華民國 |
| Start date | 2015-11-27 |
| End date | 2015-11-27 |
| Review system | 是 |
| Language | Traditional Chinese |