具封裝體印刷電路板受熱之溫度場分析與實驗驗證
| Year | 2009 |
| Author | 洪辰雄* |
| Author count | 1 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2009 |
| Symposium name | 2009精密機械製造科技研討會 |
| Start page | 1 |
| End page | 9 |
| Publication city | 屏東 |
| Publication country | 中華民國 |
| Start date | 2009-05-22 |
| End date | 2009-05-22 |
| Review system | 否 |
| Language | Traditional Chinese |