具加熱晶片之印刷電路板於熱效應下之模型驗證
| Year | 2011 |
| Author | 王栢村*, , , , |
| Author count | 5 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2011 |
| Symposium name | 中華民國振動與噪音工程學會第19屆學術研討會 |
| Publication city | 彰化 |
| Publication country | 中華民國 |
| Start date | 2011-06-25 |
| End date | 2011-06-25 |
| Review system | 否 |
| Language | Traditional Chinese |