Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
| Year | 2012 |
| Author | 曹龍泉*, W.T.Huang, M. W. Wu, Sheng-Lung, Su |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2012 |
| Publication month | 8 |
| Journal name | 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| Journal sponsor | IEEE |
| Publication area | 中華民國 |
| Volume | 2012 |
| Start page | 465 |
| End page | 468 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |