Optimization Study on Ultrasonic Vibration-Assisted Removal of Grinding Chips in Grinding of Ti-6Al-4V Alloy

Optimization Study on Ultrasonic Vibration-Assisted Removal of Grinding Chips in Grinding of Ti-6Al-4V Alloy

Professor    7014    weitai@mail.npust.edu.tw
Year2025
Author黃惟泰*
Author count1
Created date2025-03-19
Author order1
Corresponding authortrue
Publication year2025
Symposium name2025 IEEE 11th International Conference on Applied System Innovation (IEEE ICASI 2025)
Publication city Tokyo
Publication country日本
Start date2025-04-22
End date2025-04-25
Review system
LanguageForeign Language
Attached projectNSTC 113-2221-E-020 -016 -MY2