Magnetic Force Enhanced Atmospheric Plasma Polishing Ability to Improve Surface Roughness of Copper Base Materials
Magnetic Force Enhanced Atmospheric Plasma Polishing Ability to Improve Surface Roughness of Copper Base Materials
| Year | 2021 |
| Author | 陳晧隆* |
| Author count | 1 |
| Created date | 2021-09-15 |
| Author order | 1 |
| Corresponding author | true |
| Publication year | 2021 |
| Symposium name | The 6th International Conference on Precision Machinery and Manufacturing Technology 2021 (ICPMMT 2021) |
| Publication city | Pingtung |
| Publication country | 中華民國 |
| Start date | 2021-05-21 |
| End date | 2021-05-23 |
| Review system | 是 |
| Language | Traditional Chinese |
| Attached project | MOST107-2622-E-020-012 -CC3 |