The Effect of Yttrium Addition on the Microstructures and Electrical Properties of Cu-Mn Alloy Thin Film

The Effect of Yttrium Addition on the Microstructures and Electrical Properties of Cu-Mn Alloy Thin Film

Year2019
Author李英杰*
Author count1
Created date2020-03-18
Author order3
Corresponding authortrue
Publication year2019
Symposium name2019 International Conference on Smart Science-ICSS2019
Publication city群馬
Publication country日本
Start date2019-03-30
End date2019-04-02
Review system
LanguageTraditional Chinese
Attached project106-2221-E-020 -009 -