A study of direct writing the low-melting-point In-based active alloy ink to directly make a solidified circuit
| Year | 2018 |
| Author | 曹龍泉* |
| Author count | 1 |
| Created date | 2019-03-20 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2018 |
| Symposium name | 科技部工程司機械固力、熱流與能源學門聯合成果發表會 |
| Start page | 1 |
| End page | 1 |
| Publication city | 嘉義 |
| Publication country | 中華民國 |
| Start date | 2018-11-30 |
| End date | 2018-11-30 |
| Review system | 否 |
| Language | Traditional Chinese |