具加熱晶片之印刷電路板於熱場分析與模型驗證

具加熱晶片之印刷電路板於熱場分析與模型驗證

Professor    7017    wangbt@mail.npust.edu.tw
Year2011
Author王栢村*, , , ,
Author count5
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2011
Symposium name2011精密機械與製造科技研討會論文集
Publication city屏東
Publication country中華民國
Start date2011-05-20
End date2011-05-20
Review system
LanguageTraditional Chinese