具加熱晶片之印刷電路板於熱效應下之模型驗證
Year | 2011 |
Author | 王栢村*, , , , |
Author count | 5 |
Created date | 2019-02-19 |
Author order | 1 |
Corresponding author | false |
Publication year | 2011 |
Symposium name | 中華民國振動與噪音工程學會第19屆學術研討會 |
Publication city | 彰化 |
Publication country | 中華民國 |
Start date | 2011-06-25 |
End date | 2011-06-25 |
Review system | 否 |
Language | Traditional Chinese |