Number of vacuum holes influence on BGA encapsulation Process

Number of vacuum holes influence on BGA encapsulation Process

Professor    7016 實驗室:粉體技術研發實驗室 (分機7348)    cschou@mail.npust.edu.tw
Year2012
Author周春禧, Chi-Jung Wu*
Author count2
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2012
Symposium name2012年智慧電子應用設計研討會
Publication city桃園縣
Publication country中華民國
Start date2012-02-06
End date2012-02-06
Review system
LanguageTraditional Chinese