Investigations of the Mixed-mode Fracture of IC Package Interfaces

Investigations of the Mixed-mode Fracture of IC Package Interfaces

Associate Professor    08-7703202#7454、(L)7480    c123@mail.npust.edu.tw
Year2004
Author陳永昌*
Author count1
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2004
Symposium nameSEM X International Congress & Exposition on Experimental and Applied Mechanics
Publication cityCalifornia
Publication country中華民國
Start date2004-06-07
End date2004-06-07
Review system
LanguageForeign Language