Investigations of the Mixed-mode Fracture of IC Package Interfaces
| Year | 2004 |
| Author | 陳永昌* |
| Author count | 1 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2004 |
| Symposium name | SEM X International Congress & Exposition on Experimental and Applied Mechanics |
| Publication city | California |
| Publication country | 中華民國 |
| Start date | 2004-06-07 |
| End date | 2004-06-07 |
| Review system | 否 |
| Language | Foreign Language |