The Effect of Moisture on Adhesion Features of the Underfill/solder mask/substrate Joint
| Year | 2004 |
| Author | 陳永昌*, Hsieh C.C., Wu Y.D. |
| Author count | 3 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2004 |
| Symposium name | SEM X International Congress & Exposition on Experimental and Applied Mechanics |
| Publication city | California |
| Publication country | 中華民國 |
| Start date | 2004-06-07 |
| End date | 2004-06-07 |
| Review system | 否 |
| Language | Foreign Language |