The Effect of Moisture on Adhesion Features of the Underfill/solder mask/substrate Joint
Year | 2004 |
Author | 陳永昌*, Hsieh C.C., Wu Y.D. |
Author count | 3 |
Created date | 2019-02-19 |
Author order | 1 |
Corresponding author | false |
Publication year | 2004 |
Symposium name | SEM X International Congress & Exposition on Experimental and Applied Mechanics |
Publication city | California |
Publication country | 中華民國 |
Start date | 2004-06-07 |
End date | 2004-06-07 |
Review system | 否 |
Language | Foreign Language |