The simulation on butterfly laser module packaging employing stainless steel clip

The simulation on butterfly laser module packaging employing stainless steel clip

Professor    7008    ychsux@mail.npust.edu.tw
Year2008
Author許益誠*
Author count1
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2008
Symposium nameInternational Conference on Laser Applications in Life Sciences (LALS 2008)
Publication cityTaipei
Publication country中華民國
Start date2008-12-01
End date2008-12-01
Review system
LanguageForeign Language