Effect of In Addition on Sn-Ag-Sb Lead-Free Solder System

Effect of In Addition on Sn-Ag-Sb Lead-Free Solder System

Year2008
AuthorH.T. Lee*, Y.F. Chen, 洪廷甫, H.W. Huang
Author count4
Created date2019-02-19
Author order3
Corresponding authorfalse
Publication year2008
Symposium name10th International Conference on Electronics Materials and Packaging
Publication city台北
Publication country中華民國
Start date2008-12-09
End date2008-12-09
Review system
LanguageForeign Language