多晶片模組膠材性質分析及膠材硬化製程後之結構應力模擬
Year | 2008 |
Author | 盧威華*, |
Author count | 2 |
Created date | 2019-02-19 |
Author order | 1 |
Corresponding author | false |
Publication year | 2008 |
Symposium name | 2008年中國材料科學學會年會 |
Publication city | 臺北科技大學 |
Publication country | 中華民國 |
Start date | 2008-11-21 |
End date | 2008-11-21 |
Review system | 否 |
Language | Traditional Chinese |