具封裝體印刷電路板受熱之溫度場分析與實驗驗證

具封裝體印刷電路板受熱之溫度場分析與實驗驗證

Assistant Professor    7033    chhung@mail.npust.edu.tw
Year2009
Author洪辰雄*
Author count1
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2009
Symposium name2009精密機械製造科技研討會
Start page1
End page9
Publication city屏東
Publication country中華民國
Start date2009-05-22
End date2009-05-22
Review system
LanguageTraditional Chinese