具封裝體印刷電路板受熱之溫度場分析與實驗驗證
Year | 2009 |
Author | 洪辰雄* |
Author count | 1 |
Created date | 2019-02-19 |
Author order | 1 |
Corresponding author | false |
Publication year | 2009 |
Symposium name | 2009精密機械製造科技研討會 |
Start page | 1 |
End page | 9 |
Publication city | 屏東 |
Publication country | 中華民國 |
Start date | 2009-05-22 |
End date | 2009-05-22 |
Review system | 否 |
Language | Traditional Chinese |