有無熱效應印刷電路板之振動特性模擬分析比較

有無熱效應印刷電路板之振動特性模擬分析比較

Professor    7017    wangbt@mail.npust.edu.tw
Year2009
Author王栢村*, , , , ,
Author count6
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2009
Symposium name2009精密機械與製造科技研討會
Publication city屏東
Publication country中華民國
Start date2009-05-22
End date2009-05-22
Review system
LanguageTraditional Chinese