具封裝體印刷電路板受熱之溫度場分析與實驗驗證

具封裝體印刷電路板受熱之溫度場分析與實驗驗證

王栢村

College of Engineering Department of Mechanical Engineering

Professor 7017 wangbt@mail.npust.edu.tw

Year	2009
Author	王栢村*, 洪辰雄, , , , ,
Author count	7
Created date	2019-02-19
Author order	1
Corresponding author	false
Publication year	2009
Symposium name	2009精密機械與製造科技研討會
Publication city	屏東
Publication country	中華民國
Start date	2009-05-22
End date	2009-05-22
Review system	否
Language	Traditional Chinese