三晶片模組構裝隻膠材/晶片強度分析及溫度循環試驗結構應力模擬
| Year | 2009 |
| Author | 盧威華*, |
| Author count | 2 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2009 |
| Symposium name | 2009中國材料科學學會年會 |
| Publication city | 國立東華大學 |
| Publication country | 中華民國 |
| Start date | 2009-11-26 |
| End date | 2009-11-26 |
| Review system | 否 |
| Language | Traditional Chinese |