隨機振動與熱效應複合負載之印刷電路板響應預測分析

隨機振動與熱效應複合負載之印刷電路板響應預測分析

Professor    7017    wangbt@mail.npust.edu.tw
Year2010
Author王栢村*, , , , ,
Author count6
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2010
Symposium name2010 ANSYS Conference
Publication city台北
Publication country中華民國
Start date2010-10-14
End date2010-10-14
Review system
LanguageTraditional Chinese