晶片堆疊偏移距離及封裝膠材熱膨脹係數對5晶片系統構裝在膠材硬化製程條件下之結構應力效應
Year | 2016 |
Author | |
Created date | 2019-01-16 |
Author order | 2 |
Corresponding author | true |
Publication year | 2016 |
Symposium name | 2016光電與通訊工程應用研討會 |
Publication city | 高雄 |
Publication country | 中華民國 |
Start date | 2016-11-25 |
End date | 2016-11-25 |
Review system | 是 |
Language | Traditional Chinese |