The Effect of Yttrium Addition on the Microstructures and Electrical Properties of Cu-Mn Alloy Thin Film

The Effect of Yttrium Addition on the Microstructures and Electrical Properties of Cu-Mn Alloy Thin Film

Year2019
Author李英杰*
Author count1
Created date2020-03-18
Author order第三作者
Corresponding author
Publication year2019
Publication month11
Journal nameAdvances in Materials Science and Engineering
Journal sponsorHindawi
Publication area美國
Volume2019
Issue----
Start page1
End page7
Publication type
Review system
LanguageForeign Language
Attached project106-2221-E-020 -009 -