Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn−Ag−Ti active solder
Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn−Ag−Ti active solder
Year | 2018 |
Author | 曹龍泉*, S. Y. CHANG, Y. C. YU |
Author count | 3 |
Created date | 2019-03-18 |
Author order | 第一作者 |
Corresponding author | 是 |
Publication year | 2018 |
Publication month | 4 |
Journal name | Trans. Nonferrous Met. Soc. China |
Journal sponsor | Elsevier |
Publication area | 荷蘭王國 |
Issue | 28 |
Start page | 748 |
End page | 756 |
Publication type | |
Review system | 是 |
Language | Bilingual |
Attached project | 科技部MOST 105-ET-E-020- 002-ET, 105-2622-E-020-003-CC3. |