Effect of Al203 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish

Effect of Al203 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish

Year2011
AuthorT. H. Cheng, 曹龍泉*, F. S. Wang, W. Y. Kuo
Author count4
Created date2019-02-19
Author order第二作者
Corresponding author
Publication year2011
Publication month8
Journal name2011 International Conference on Electronic Packaging Technology & High Density Packaging
Publication area中華民國
Start page374
End page378
Publication type
Review system
LanguageForeign Language
Attached project