The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction
| Year | 2012 |
| Author | S. Y. Chang, 曹龍泉*, M. W. Wu, C. W. Chen |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2012 |
| Publication month | 1 |
| Journal name | J Mater Sci: Mater Electron |
| Journal sponsor | Springer |
| Publication area | 中華民國 |
| Issue | 23 |
| Start page | 100 |
| End page | 107 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |