Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
| Year | 2011 |
| Author | 曹龍泉* |
| Author count | 1 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 8 |
| Journal name | Journal of Alloys and Compounds |
| Journal sponsor | Elsevier |
| Publication area | 中華民國 |
| Issue | 509 |
| Start page | 8441 |
| End page | 8448 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |