Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate
Year | 2011 |
Author | 曹龍泉*, C.P. Chu,, S.F. Peng |
Author count | 3 |
Created date | 2019-02-19 |
Author order | 第一作者 |
Corresponding author | 是 |
Publication year | 2011 |
Publication month | 9 |
Journal name | Microelectronic Engineering |
Journal sponsor | Elsevier |
Publication area | 中華民國 |
Issue | 88 |
Start page | 2964 |
End page | 2969 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |