Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder

Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder

Year2011
AuthorT. H. Chuang, M.W.Wu, S. Y. Chang, S. F. Ping, 曹龍泉*
Author count5
Created date2019-02-19
Author order第四(以上)作者
Corresponding author
Publication year2011
Publication month11
Journal nameJ Mater Sci: Mater Electron
Journal sponsorspringer
Publication area中華民國
Issue22
Start page1021
End page1027
Publication type
Review system
LanguageForeign Language
Attached project