Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE)filler

Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE)filler

Year2013
Author曹龍泉*
Author count1
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2013
Publication month3
Journal nameMaterials Science & Engineering A
Journal sponsorElsevier
Publication area中華民國
Issue565
Start page63
End page71
Publication type
Review system
LanguageForeign Language
Attached project