Direct robust active bonding between Al heat sink and Si substrate

Direct robust active bonding between Al heat sink and Si substrate

Year2012
Author曹龍泉*, S. Y. Chang, Meng-Syuan, Huang, C. S. Chen
Author count4
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2012
Publication month8
Journal name2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
Journal sponsorIEEE
Publication area中華民國
Volume2012
Start page1635
End page1638
Publication type
Review system
LanguageForeign Language
Attached project