Direct robust active bonding between Al heat sink and Si substrate
Year | 2012 |
Author | 曹龍泉*, S. Y. Chang, Meng-Syuan, Huang, C. S. Chen |
Author count | 4 |
Created date | 2019-02-19 |
Author order | 第一作者 |
Corresponding author | 是 |
Publication year | 2012 |
Publication month | 8 |
Journal name | 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
Journal sponsor | IEEE |
Publication area | 中華民國 |
Volume | 2012 |
Start page | 1635 |
End page | 1638 |
Publication type | |
Review system | 否 |
Language | Foreign Language |
Attached project | 無 |