Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging

Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging

Year2012
AuthorT.H. Chuang, 曹龍泉*, Chien-Han Chung, S.Y. Chang
Author count4
Created date2019-02-19
Author order第二作者
Corresponding author
Publication year2012
Publication month8
Journal nameMaterials & Desig
Publication area中華民國
Issue39
Start page475
End page483
Publication type
Review system
LanguageForeign Language
Attached project