Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder
| Year | 2012 |
| Author | C.L. Chuang, 曹龍泉*, H.K. Lin, L.P. Feng |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2012 |
| Publication month | 12 |
| Journal name | Materials Science & Engineering A |
| Publication area | 中華民國 |
| Issue | 558 |
| Start page | 478 |
| End page | 484 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |