Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Year2012
Author曹龍泉*, W.T.Huang, M. W. Wu, Sheng-Lung, Su
Author count4
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2012
Publication month8
Journal name2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
Journal sponsorIEEE
Publication area中華民國
Volume2012
Start page465
End page468
Publication type
Review system
LanguageForeign Language
Attached project