Simulation Analysis and Experimental Verification of Electroplating Process for Flip-Chip Solder Bumps

Simulation Analysis and Experimental Verification of Electroplating Process for Flip-Chip Solder Bumps

Year2002
Author苗志銘*
Author count1
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2002
Publication month1
Journal nameJournal of Materials Science and Engineering
Publication area中華民國
VolumeVol. 34
IssueNo. 1
Start page8
End page16
Publication type
Review system
LanguageForeign Language
Attached project